• COPPER   C1100

Description

Alloy Grade Chemical Composition
China GB USA UNS EURO EN JAPAN JIS Cu + Ag % P % Fe % Ni % Pb %
T2 - - C1100 ≥99.90 - ≤0.005 ≤0.005 ≤0.005

Density G/Cm3 Conductivity %IACS Thermal Conductivity W/(M.K) Modulus Of Elasticity GPa Specific Heat J/(G.K) Thermal Expansion Coefcien 10-6/K Cold-Workability Machinability Plating Capability Hot Dip Tin Plating Property Weldability Anti-Corrosion
8.83 ≥98 385 117 0.385 18 Excellent Suitable Excellent Excellent Good Excellent

Temper HV Hardness Tension test Bend properties
MPa Tensile strength Elongation % Thickness mm Bend angle
060 ≤70 ≥195 ≥35 ≥2.0 180° - ≥7.5
H01 65 - 95 215 - 295 ≥25 ≥2.0 180° Thickness*0.5 times ≥7.0
H02 80 - 110 245 - 345 ≥8 ≥2.0 180° Thickness*1 times ≥5.5
H04 90 - 120 295 - 395 ≥3 ≥2.0 180° Thickness*2 times -